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Applied Physics Reviews — 2005

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Strained Si, SiGe, and Ge channels for high-mobility metal-oxide-semiconductor field-effect transistors

Minjoo L. Lee, Eugene A. Fitzgerald, Mayank T. Bulsara, Matthew T. Currie, and Anthony Lochtefeld

J. Appl. Phys. 97, 011101 (2005); http://dx.doi.org/10.1063/1.1819976 (28 pages)

Online Publication Date: 9 December 2004

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This article reviews the history and current progress in high-mobility strained Si, SiGe, and Ge channel metal-oxide-semiconductor field-effect transistors (MOSFETs). We start by providing a chronological overview of important milestones and discoveries that have allowed heterostructures grown on Si substrates to transition from purely academic research in the 1980’s and 1990’s to the commercial development that is taking place today. We next provide a topical review of the various types of strain-engineered MOSFETs that can be integrated onto relaxed Si1−xGex, including surface-channel strained Si n- and p-MOSFETs, as well as double-heterostructure MOSFETs which combine a strained Si surface channel with a Ge-rich buried channel. In all cases, we will focus on the connections between layer structure, band structure, and MOS mobility characteristics. Although the surface and starting substrate are composed of pure Si, the use of strained Si still creates new challenges, and we shall also review the literature on short-channel device performance and process integration of strained Si. The review concludes with a global summary of the mobility enhancements available in the SiGe materials system and a discussion of implications for future technology generations.
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85.30.Tv Field effect devices
72.20.Ht High-field and nonlinear effects
01.30.Rr Surveys and tutorial papers; resource letters
73.20.At Surface states, band structure, electron density of states

Manipulation and detection of single electrons for future information processing

Yukinori Ono, Akira Fujiwara, Katsuhiko Nishiguchi, Hiroshi Inokawa, and Yasuo Takahashi

J. Appl. Phys. 97, 031101 (2005); http://dx.doi.org/10.1063/1.1843271 (19 pages)

Online Publication Date: 19 January 2005

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The ultimate goal of future information processing might be the realization of a circuit in which one bit is represented by a single electron. Such a challenging circuit would comprise elemental devices whose tasks are to drag, transfer, and detect single electrons. In achieving these tasks, the Coulomb blockade, which occurs in tiny conducting materials, plays an important role. This paper describes the current status of research on such single-charge-control devices from the viewpoints of circuit applications.
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85.35.Gv Single electron devices
85.30.Tv Field effect devices
85.35.Ds Quantum interference devices
84.30.Sk Pulse and digital circuits
73.23.Hk Coulomb blockade; single-electron tunneling
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Vertically aligned carbon nanofibers and related structures: Controlled synthesis and directed assembly

A. V. Melechko, V. I. Merkulov, T. E. McKnight, M. A. Guillorn, K. L. Klein, D. H. Lowndes, and M. L. Simpson

J. Appl. Phys. 97, 041301 (2005); http://dx.doi.org/10.1063/1.1857591 (39 pages)

Online Publication Date: 3 February 2005

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The controlled synthesis of materials by methods that permit their assembly into functional nanoscale structures lies at the crux of the emerging field of nanotechnology. Although only one of several materials families is of interest, carbon-based nanostructured materials continue to attract a disproportionate share of research effort, in part because of their wide-ranging properties. Additionally, developments of the past decade in the controlled synthesis of carbon nanotubes and nanofibers have opened additional possibilities for their use as functional elements in numerous applications. Vertically aligned carbon nanofibers (VACNFs) are a subclass of carbon nanostructured materials that can be produced with a high degree of control using catalytic plasma-enhanced chemical-vapor deposition (C-PECVD). Using C-PECVD the location, diameter, length, shape, chemical composition, and orientation can be controlled during VACNF synthesis. Here we review the CVD and PECVD systems, growth control mechanisms, catalyst preparation, resultant carbon nanostructures, and VACNF properties. This is followed by a review of many of the application areas for carbon nanotubes and nanofibers including electron field-emission sources, electrochemical probes, functionalized sensor elements, scanning probe microscopy tips, nanoelectromechanical systems (NEMS), hydrogen and charge storage, and catalyst support. We end by noting gaps in the understanding of VACNF growth mechanisms and the challenges remaining in the development of methods for an even more comprehensive control of the carbon nanofiber synthesis process.
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81.05.U- Carbon/carbon-based materials
81.07.De Nanotubes
81.16.Hc Catalytic methods
81.15.Gh Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)
79.70.+q Field emission, ionization, evaporation, and desorption
61.46.-w Structure of nanoscale materials
68.65.-k Low-dimensional, mesoscopic, nanoscale and other related systems: structure and nonelectronic properties
52.77.-j Plasma applications
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
85.35.Kt Nanotube devices
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Secondary electron contrast in low-vacuum∕environmental scanning electron microscopy of dielectrics

Bradley L. Thiel and Milos Toth

J. Appl. Phys. 97, 051101 (2005); http://dx.doi.org/10.1063/1.1861149 (18 pages)

Online Publication Date: 16 February 2005

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Low vacuum scanning electron microscopy (SEM) is a high-resolution technique, with the ability to obtain secondary electron images of uncoated, nonconductive specimens. This feat is achieved by allowing a small pressure of gas in the specimen chamber. Gas molecules are ionized by primary electrons, as well as by those emitted from the specimen. These ions then assist in dissipating charge from the sample. However, the interactions between the ions, the specimen, and the secondary electrons give rise to contrast mechanisms that are unique to these instruments. This paper summarizes the central issues with charging and discusses how electrostatically stable, reproducible imaging conditions are achieved. Recent developments in understanding the physics of image formation are reviewed, with an emphasis on how local variations in electronic structure, dynamic charging processes, and interactions between ionized gas molecules and low-energy electrons at and near the sample surface give rise to useful contrast mechanisms. Many of the substances that can be examined in these instruments, including conductive polymers and liquids, possess charge carriers having intermediate mobilities, as compared to metals and most solid insulators. This can give rise to dynamic contrast mechanisms, and allow for characterization techniques for mapping electronic inhomogeneities in electronic materials and other dielectrics. Finally, a number of noteworthy application areas published in the literature are reviewed, concentrating on cases where interesting contrast has been reported, or where analysis in a conventional SEM would not be possible. In the former case, a critical analysis of the results will be given in light of the imaging theory put forth.
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07.78.+s Electron, positron, and ion microscopes; electron diffractometers
07.05.Pj Image processing
42.30.Va Image forming and processing
07.89.+b Environmental effects on instruments (e.g., radiation and pollution effects)
07.30.-t Vacuum apparatus
79.70.+q Field emission, ionization, evaporation, and desorption
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Luminescence properties of defects in GaN

Michael A. Reshchikov and Hadis Morkoç

J. Appl. Phys. 97, 061301 (2005); http://dx.doi.org/10.1063/1.1868059 (95 pages)

Online Publication Date: 15 March 2005

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Gallium nitride (GaN) and its allied binaries InN and AIN as well as their ternary compounds have gained an unprecedented attention due to their wide-ranging applications encompassing green, blue, violet, and ultraviolet (UV) emitters and detectors (in photon ranges inaccessible by other semiconductors) and high-power amplifiers. However, even the best of the three binaries, GaN, contains many structural and point defects caused to a large extent by lattice and stacking mismatch with substrates. These defects notably affect the electrical and optical properties of the host material and can seriously degrade the performance and reliability of devices made based on these nitride semiconductors. Even though GaN broke the long-standing paradigm that high density of dislocations precludes acceptable device performance, point defects have taken the center stage as they exacerbate efforts to increase the efficiency of emitters, increase laser operation lifetime, and lead to anomalies in electronic devices. The point defects include native isolated defects (vacancies, interstitial, and antisites), intentional or unintentional impurities, as well as complexes involving different combinations of the isolated defects. Further improvements in device performance and longevity hinge on an in-depth understanding of point defects and their reduction. In this review a comprehensive and critical analysis of point defects in GaN, particularly their manifestation in luminescence, is presented. In addition to a comprehensive analysis of native point defects, the signatures of intentionally and unintentionally introduced impurities are addressed. The review discusses in detail the characteristics and the origin of the major luminescence bands including the ultraviolet, blue, green, yellow, and red bands in undoped GaN. The effects of important group-II impurities, such as Zn and Mg on the photoluminescence of GaN, are treated in detail. Similarly, but to a lesser extent, the effects of other impurities, such as C, Si, H, O, Be, Mn, Cd, etc., on the luminescence properties of GaN are also reviewed. Further, atypical luminescence lines which are tentatively attributed to the surface and structural defects are discussed. The effect of surfaces and surface preparation, particularly wet and dry etching, exposure to UV light in vacuum or controlled gas ambient, annealing, and ion implantation on the characteristics of the defect-related emissions is described.
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81.05.Ea III-V semiconductors
78.55.Cr III-V semiconductors
81.40.Tv Optical and dielectric properties related to treatment conditions
61.72.J- Point defects and defect clusters
61.80.Ba Ultraviolet, visible, and infrared radiation effects (including laser radiation)
61.72.S- Impurities in crystals
81.65.Cf Surface cleaning, etching, patterning
61.72.Cc Kinetics of defect formation and annealing
61.72.uj III-V and II-VI semiconductors
61.72.Ff Direct observation of dislocations and other defects (etch pits, decoration, electron microscopy, x-ray topography, etc.)
71.55.Eq III-V semiconductors
61.82.Fk Semiconductors
81.40.Wx Radiation treatment (particle and electromagnetic)
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Perpendicular magnetic recording: Playback

Dmitri Litvinov and Sakhrat Khizroev

J. Appl. Phys. 97, 071101 (2005); http://dx.doi.org/10.1063/1.1880449 (12 pages)

Online Publication Date: 23 March 2005

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For the past several years, perpendicular magnetic recording has been under intense scrutiny as the primary alternative to magnetic data storage technologies in place today. Major system components, write heads and media in particular, have been the subject of extensive studies. Less attention, however, has been devoted to the playback processes in perpendicular recording systems. The playback heads used in technology demonstrations remain largely unchanged from their longitudinal recording counterparts. It is an open question whether the longitudinal playback-head design is optimal for perpendicular recording. For example, application of longitudinal playback heads in perpendicular recording leads to undesirable phenomena associated with modified playback response, increased flying height sensitivity, adjacent track interference, and calls for major modifications of the existing read channels. The subject of this work is a detailed discussion of the playback physics, in perpendicular recording systems; the focus being to establish the design guidelines for optimized perpendicular playback heads, which are equivalent or superior in their performance characteristics to conventional shielded readers used in longitudinal recording. Conformal mapping is applied to demonstrate the playback wave form equivalency between a shielded and dual-pole readers when applied in longitudinal and perpendicular recording, respectively. Utilizing extensive three-dimensional modeling and reciprocity principle to evaluate the performance of various playback-head configurations, it is demonstrated that differential reader configurations possess advantageous playback characteristics, such as higher playback amplitude, improved spatial resolution, and reduced dependence on flight-height variations as compared to conventional shielded readers. Modified design of differential readers with a single magnetoresistive sensor is proposed to overcome the manufacturability issues associated with a conventional dual-sensor differential reader.
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85.70.Kh Magnetic thin film devices: magnetic heads (magnetoresistive, inductive, etc.); domain-motion devices, etc.
85.70.Ay Magnetic device characterization, design, and modeling
43.38.Qg Magnetic and electrostatic recording and reproducing systems

Quaternary InAlGaN-based high-efficiency ultraviolet light-emitting diodes

Hideki Hirayama

J. Appl. Phys. 97, 091101 (2005); http://dx.doi.org/10.1063/1.1899760 (19 pages)

Online Publication Date: 26 April 2005

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In order to realize 250–350-nm-band high-efficiency deep ultraviolet (UV) emitting devices using group-III-nitride materials, it is necessary to obtain high-efficiency UV emission from wide-band-gap (In)AlGaN. The use of the In-segregation effect, which has already been used for InGaN blue emitting devices, is quite effective for achieving high-efficiency deep UV emission. We have demonstrated high-efficiency UV emission from quaternary InAlGaN-based quantum wells in the wavelength range between 290 and 375 nm at room temperature (RT) using the In-segregation effect. Emission fluctuations in the submicron region due to In segregation were clearly observed for quaternary InAlGaN epitaxial layers. An internal quantum efficiency as high as 15% was estimated for a quaternary InAlGaN-based single quantum well at RT. Such high-efficiency UV emission can even be obtained on high threading-dislocation density buffer layers. A comparison of electroluminescence is made between light-emitting diodes (LEDs) with InAlGaN, AlGaN, and GaN active regions fabricated on SiC substrates with emission wavelengths between 340 and 360 nm. The emission intensity from the quaternary InAlGaN UV-LED was more than one order of magnitude higher than that from the AlGaN or GaN UV-LEDs under RT cw operation. We therefore fabricated 310–350-nm-band deep UV-LEDs with quaternary InAlGaN active regions. We achieved submilliwatt output power under RT pulsed operation for 308–314-nm LEDs. We also demonstrated a high output power of 7.4 mW from a 352-nm quaternary InAlGaN-based LED fabricated on a GaN substrate under RT cw operation. The maximum external quantum efficiency (EQE) of the 352-nm InAlGaN-based LED was higher than that obtained for an AlGaN-based LED with the same geometry. From these results, the advantages of the use of quaternary InAlGaN in 350-nm-band UV emitters were revealed.
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85.60.Jb Light-emitting devices
85.60.Gz Photodetectors (including infrared and CCD detectors)

Ultrafast electron microscopy in materials science, biology, and chemistry

Wayne E. King, Geoffrey H. Campbell, Alan Frank, Bryan Reed, John F. Schmerge, Bradley J. Siwick, Brent C. Stuart, and Peter M. Weber

J. Appl. Phys. 97, 111101 (2005); http://dx.doi.org/10.1063/1.1927699 (27 pages)

Online Publication Date: 8 June 2005

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The use of pump-probe experiments to study complex transient events has been an area of significant interest in materials science, biology, and chemistry. While the emphasis has been on laser pump with laser probe and laser pump with x-ray probe experiments, there is a significant and growing interest in using electrons as probes. Early experiments used electrons for gas-phase diffraction of photostimulated chemical reactions. More recently, scientists are beginning to explore phenomena in the solid state such as phase transformations, twinning, solid-state chemical reactions, radiation damage, and shock propagation. This review focuses on the emerging area of ultrafast electron microscopy (UEM), which comprises ultrafast electron diffraction (UED) and dynamic transmission electron microscopy (DTEM). The topics that are treated include the following: (1) The physics of electrons as an ultrafast probe. This encompasses the propagation dynamics of the electrons (space-charge effect, Child’s law, Boersch effect) and extends to relativistic effects. (2) The anatomy of UED and DTEM instruments. This includes discussions of the photoactivated electron gun (also known as photogun or photoelectron gun) at conventional energies (60–200 keV) and extends to MeV beams generated by rf guns. Another critical aspect of the systems is the electron detector. Charge-coupled device cameras and microchannel-plate-based cameras are compared and contrasted. The effect of various physical phenomena on detective quantum efficiency is discussed. (3) Practical aspects of operation. This includes determination of time zero, measurement of pulse-length, and strategies for pulse compression. (4) Current and potential applications in materials science, biology, and chemistry. UEM has the potential to make a significant impact in future science and technology. Understanding of reaction pathways of complex transient phenomena in materials science, biology, and chemistry will provide fundamental knowledge for discovery-class science.
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07.78.+s Electron, positron, and ion microscopes; electron diffractometers
06.60.Jn High-speed techniques (microsecond to femtosecond)
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Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

Riikka L. Puurunen

J. Appl. Phys. 97, 121301 (2005); http://dx.doi.org/10.1063/1.1940727 (52 pages)

Online Publication Date: 30 June 2005

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Atomic layer deposition (ALD), a chemical vapor deposition technique based on sequential self-terminating gas–solid reactions, has for about four decades been applied for manufacturing conformal inorganic material layers with thickness down to the nanometer range. Despite the numerous successful applications of material growth by ALD, many physicochemical processes that control ALD growth are not yet sufficiently understood. To increase understanding of ALD processes, overviews are needed not only of the existing ALD processes and their applications, but also of the knowledge of the surface chemistry of specific ALD processes. This work aims to start the overviews on specific ALD processes by reviewing the experimental information available on the surface chemistry of the trimethylaluminum/water process. This process is generally known as a rather ideal ALD process, and plenty of information is available on its surface chemistry. This in-depth summary of the surface chemistry of one representative ALD process aims also to provide a view on the current status of understanding the surface chemistry of ALD, in general. The review starts by describing the basic characteristics of ALD, discussing the history of ALD—including the question who made the first ALD experiments—and giving an overview of the two-reactant ALD processes investigated to date. Second, the basic concepts related to the surface chemistry of ALD are described from a generic viewpoint applicable to all ALD processes based on compound reactants. This description includes physicochemical requirements for self-terminating reactions, reaction kinetics, typical chemisorption mechanisms, factors causing saturation, reasons for growth of less than a monolayer per cycle, effect of the temperature and number of cycles on the growth per cycle (GPC), and the growth mode. A comparison is made of three models available for estimating the sterically allowed value of GPC in ALD. Third, the experimental information on the surface chemistry in the trimethylaluminum/water ALD process are reviewed using the concepts developed in the second part of this review. The results are reviewed critically, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials. Although the surface chemistry of the trimethylaluminum/water ALD process is rather well understood, systematic investigations of the reaction kinetics and the growth mode on different substrates are still missing. The last part of the review is devoted to discussing issues which may hamper surface chemistry investigations of ALD, such as problematic historical assumptions, nonstandard terminology, and the effect of experimental conditions on the surface chemistry of ALD. I hope that this review can help the newcomer get acquainted with the exciting and challenging field of surface chemistry of ALD and can serve as a useful guide for the specialist towards the fifth decade of ALD research.
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81.15.Gh Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)
68.43.Hn Structure of assemblies of adsorbates (two- and three-dimensional clustering)
68.43.Mn Adsorption kinetics
82.33.Ya Chemistry of MOCVD and other vapor deposition methods
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Plasmonics: Localization and guiding of electromagnetic energy in metal/dielectric structures

Stefan A. Maier and Harry A. Atwater

J. Appl. Phys. 98, 011101 (2005); http://dx.doi.org/10.1063/1.1951057 (10 pages)

Online Publication Date: 11 July 2005

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We review the basic physics of surface-plasmon excitations occurring at metal/dielectric interfaces with special emphasis on the possibility of using such excitations for the localization of electromagnetic energy in one, two, and three dimensions, in a context of applications in sensing and waveguiding for functional photonic devices. Localized plasmon resonances occurring in metallic nanoparticles are discussed both for single particles and particle ensembles, focusing on the generation of confined light fields enabling enhancement of Raman-scattering and nonlinear processes. We then survey the basic properties of interface plasmons propagating along flat boundaries of thin metallic films, with applications for waveguiding along patterned films, stripes, and nanowires. Interactions between plasmonic structures and optically active media are also discussed.
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81.07.Bc Nanocrystalline materials
42.70.-a Optical materials
73.20.Mf Collective excitations (including excitons, polarons, plasmons and other charge-density excitations)
71.36.+c Polaritons (including photon-phonon and photon-magnon interactions)
78.30.Er Solid metals and alloys
78.67.Bf Nanocrystals, nanoparticles, and nanoclusters
01.30.Rr Surveys and tutorial papers; resource letters
84.40.-x Radiowave and microwave (including millimeter wave) technology
42.79.Gn Optical waveguides and couplers
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A comprehensive review of ZnO materials and devices

Ü. Özgür, Ya. I. Alivov, C. Liu, A. Teke, M. A. Reshchikov, S. Doğan, V. Avrutin, S.-J. Cho, and H. Morkoç

J. Appl. Phys. 98, 041301 (2005); http://dx.doi.org/10.1063/1.1992666 (103 pages)

Online Publication Date: 30 August 2005

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The semiconductor ZnO has gained substantial interest in the research community in part because of its large exciton binding energy (60 meV) which could lead to lasing action based on exciton recombination even above room temperature. Even though research focusing on ZnO goes back many decades, the renewed interest is fueled by availability of high-quality substrates and reports of p-type conduction and ferromagnetic behavior when doped with transitions metals, both of which remain controversial. It is this renewed interest in ZnO which forms the basis of this review. As mentioned already, ZnO is not new to the semiconductor field, with studies of its lattice parameter dating back to 1935 by Bunn [Proc. Phys. Soc. London 47, 836 (1935)], studies of its vibrational properties with Raman scattering in 1966 by Damen et al. [Phys. Rev. 142, 570 (1966)], detailed optical studies in 1954 by Mollwo [Z. Angew. Phys. 6, 257 (1954)], and its growth by chemical-vapor transport in 1970 by Galli and Coker [Appl. Phys. Lett. 16, 439 (1970)]. In terms of devices, Au Schottky barriers in 1965 by Mead [Phys. Lett. 18, 218 (1965)], demonstration of light-emitting diodes (1967) by Drapak [Semiconductors 2, 624 (1968)], in which Cu2O was used as the p-type material, metal-insulator-semiconductor structures (1974) by Minami et al. [Jpn. J. Appl. Phys. 13, 1475 (1974)], ZnO/ZnSe n-p junctions (1975) by Tsurkan et al. [Semiconductors 6, 1183 (1975)], and Al/Au Ohmic contacts by Brillson [J. Vac. Sci. Technol. 15, 1378 (1978)] were attained. The main obstacle to the development of ZnO has been the lack of reproducible and low-resistivity p-type ZnO, as recently discussed by Look and Claflin [Phys. Status Solidi B 241, 624 (2004)]. While ZnO already has many industrial applications owing to its piezoelectric properties and band gap in the near ultraviolet, its applications to optoelectronic devices has not yet materialized due chiefly to the lack of p-type epitaxial layers. Very high quality what used to be called whiskers and platelets, the nomenclature for which gave way to nanostructures of late, have been prepared early on and used to deduce much of the principal properties of this material, particularly in terms of optical processes. The suggestion of attainment of p-type conductivity in the last few years has rekindled the long-time, albeit dormant, fervor of exploiting this material for optoelectronic applications. The attraction can simply be attributed to the large exciton binding energy of 60 meV of ZnO potentially paving the way for efficient room-temperature exciton-based emitters, and sharp transitions facilitating very low threshold semiconductor lasers. The field is also fueled by theoretical predictions and perhaps experimental confirmation of ferromagnetism at room temperature for potential spintronics applications. This review gives an in-depth discussion of the mechanical, chemical, electrical, and optical properties of ZnO in addition to the technological issues such as growth, defects, p-type doping, band-gap engineering, devices, and nanostructures.
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81.05.Dz II-VI semiconductors
85.30.-z Semiconductor devices
81.40.Jj Elasticity and anelasticity, stress-strain relations
62.20.D- Elasticity
71.35.-y Excitons and related phenomena
01.30.Rr Surveys and tutorial papers; resource letters

Dielectric breakdown mechanisms in gate oxides

Salvatore Lombardo, James H. Stathis, Barry P. Linder, Kin Leong Pey, Felix Palumbo, and Chih Hang Tung

J. Appl. Phys. 98, 121301 (2005); http://dx.doi.org/10.1063/1.2147714 (36 pages)

Online Publication Date: 29 December 2005

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In this paper we review the subject of oxide breakdown (BD), focusing our attention on the case of the gate dielectrics of interest for current Si microelectronics, i.e., Si oxides or oxynitrides of thickness ranging from some tens of nanometers down to about 1 nm. The first part of the paper is devoted to a concise description of the subject concerning the kinetics of oxide degradation under high-voltage stress and the statistics of the time to BD. It is shown that, according to the present understanding, the BD event is due to a buildup in the oxide bulk of defects produced by the stress at high voltage. Defect concentration increases up to a critical value corresponding to the onset of one percolation path joining the gate and substrate across the oxide. This triggers the BD, which is therefore believed to be an intrinsic effect, not due to preexisting, extrinsic defects or processing errors. We next focus our attention on experimental studies concerning the kinetics of the final event of BD, during which the gate leakage increases above acceptable levels. In conditions of intrinsic BD, the leakage increase is due to the growth of damage within the oxide in localized regions. Observations concerning this damage are reviewed and discussed. The measurement of the current, voltage, and power dissipated during the BD transient are also reported and discussed in comparison with the data of structural damage. We then describe the current understanding concerning the dependence of the BD current transient on the conditions of electric field and voltage. In particular, as the oxide thickness and, as a consequence, the voltage levels used for accelerated reliability tests have decreased, the BD transient exhibits a marked change in behavior. As the stress voltage is decreased below a threshold value, the BD transient becomes slower. This recently discovered phenomenon has been termed progressive BD, i.e., a gradual growth of the BD spot and of the gate leakage, with a time scale that under operation conditions can be a large fraction of the total time to BD. We review the literature on this phenomenon, describing the current understanding concerning the dependence of the effect on voltage, temperature, oxide thickness, sample geometry, and its physical structure. We also discuss the possible relation to the so-called soft oxide BD mode and propose a simpler, more consistent terminology to describe different BD regimes. The last part of the paper is dedicated to exploratory studies, still at the early stages given the very recent subject, concerning the impact on the BD of materials for the metal-oxide-semiconductor gate stack and, in particular, metal gates.
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77.22.Jp Dielectric breakdown and space-charge effects
01.30.Rr Surveys and tutorial papers; resource letters
85.30.Tv Field effect devices
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