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The effects of vacuum ultraviolet radiation on low-k dielectric films
(Received 2 September 2011; accepted 13 August 2012; published online 4 December 2012)
© 2012 American Institute of Physics
Article Outline
- INTRODUCTION AND BACKGROUND
- CHARGE TRAPPING
- EXPOSURE SYSTEMS
- Synchrotron radiation
- Electron cyclotron resonance (ECR) plasma
- MEASUREMENT TECHNIQUES
- Substrate/photoemission currents
- VUV spectroscopy
- Surface-potential measurements
- Capacitance-voltage characteristics
- Electron-spin resonance (ESR) spectroscopy
- DIELECTRIC MATERIALS
- SYNCHROTRON EXPOSURE
- VUV spectroscopy
- CV and surface potential measurements
- Effect of ultraviolet (UV) curing on charge trapping
- Effect of dielectric-substrate interface on charge trapping
- Effect of porosity on charge trapping
- PLASMA EXPOSURE
- Charge accumulation in low-k dielectrics
- Modifications of chemical bonds and physical changes
- SUMMARY AND CONCLUSIONS
RELATED DATABASES
KEYWORDS, PACS, and IPC
Keywords
charge injection, electron traps, glass, low-k dielectric thin films, nanoporous materials, organic compounds, permittivity, photoconductivity, photoemission, porosity, silicon compounds, ultraviolet radiation effects
PACS
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Charge carriers: generation, recombination, lifetime, and trapping
-
Ultraviolet, visible, and infrared radiation effects (including laser radiation)
-
Low-permittivity dielectric films
-
Photoconduction and photovoltaic effects
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Photoconduction and photovoltaic effects
-
Permittivity (dielectric function)
International Patent Classification (IPC)
Nano-structures
ARTICLE DATA
References
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